Electronic apparatus

ABSTRACT

An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. patent application Ser. No.15/458,556, accorded a filing date of Mar. 14, 2017, which claimspriority to JP Patent Application No. 2016-073336, filed on Mar. 31,2016, the entire disclosures of which are hereby incorporated byreference.

BACKGROUND

The present technology relates to a structure of a vent of an electronicapparatus.

An electronic apparatus is disclosed in PCT Patent Publication No.WO2014/185311 (hereinafter referred to as Patent Document 1) whichincludes a frame to which various parts provided in the electronicapparatus are attached, an upper cover that covers the upper side of theframe, and a lower cover that covers the lower side of the frame. Theframe has an outer periphery formed so as to surround the various partsprovided in the electronic apparatus (particularly, a cooling fan, aheatsink, a power supply unit, an optical disk drive and so forth). Acircuit board is disposed at the upper side of the cooling fan and theheatsink. The circuit board is covered with a chassis formed from metal.

SUMMARY

In the electronic apparatus of Patent Document 1, the frame is entirelyformed from resin. In order to enhance the rigidity of the frame, it maybe necessary to increase the thickness or the size of the frame. This isnot preferable in order to achieve downsizing of the electronicapparatus.

There is a need for the present technology to provide an electronicapparatus capable of enhancing the rigidity of a frame while achievingdownsizing of the electronic apparatus.

According to an embodiment of the present technology, there is providedan electronic apparatus including a plurality of parts, a frame havingan outer periphery surrounding the plurality of parts and formed fromresin, a circuit board disposed at one side in a first direction withrespect to the plurality of parts, a chassis disposed at the one side inthe first direction with respect to the plurality of parts, attached tothe frame, and formed from metal, and a metal plate disposed at an otherside in the first direction with respect to at least one of theplurality of parts and attached to the frame.

The above and other objects, features and advantages of the presenttechnology will become apparent from the following description and theappended claims, taken in conjunction with the accompanying drawings inwhich like parts or elements are denoted by like reference characters.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an electronic apparatus according to anembodiment of the present technology;

FIG. 2 is an exploded perspective view of the electronic apparatus;

FIG. 3 is an exploded perspective view of a main body depicted in FIG.2;

FIG. 4A is a top plan view of the main body of the electronic apparatus;

FIG. 4B is a top plan view of a frame to which a lower cover isattached;

FIG. 5 is a sectional view of the electronic apparatus taken along lineV-V of FIG. 4A;

FIG. 6 is a perspective view of a metal plate, the frame, and a coolingfan depicted in FIG. 3;

FIG. 7 is an enlarged view of a region indicated by reference characterVII in FIG. 5;

FIG. 8 is a rear elevational view of the electronic apparatus;

FIG. 9 is a sectional view taken along line IX-IX of FIG. 8; and

FIG. 10 is a perspective view depicting a rear side of the frame, apower supply unit, and a lower cover.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In the following, an embodiment of the present technology is describedwith reference to the drawings. FIG. 1 is a perspective view of anelectronic apparatus 1 according to the embodiment of the presenttechnology. FIG. 2 is an exploded perspective view of the electronicapparatus 1. FIG. 3 is an exploded perspective view of a main body 10depicted in FIG. 2. FIG. 4A is a top plan view of the main body 10. FIG.4B is a top plan view of a frame 20 to which a lower cover 60 isattached. FIG. 5 is a sectional view of the electronic apparatus 1 takenalong line V-V of FIG. 4A. FIG. 6 is a perspective view of a metal plate39, the frame 20, and a cooling fan 5 depicted in FIG. 3.

In the description given below, reference characters X1, X2, Y1, Y2, Z1,and Z2 depicted in FIG. 1 indicate a leftward direction, a rightwarddirection, a forward direction, a rearward direction, an upwarddirection, and a downward direction, respectively.

The electronic apparatus 1 is an entertainment apparatus that functions,for example, as a game apparatus or an audio/visual apparatus. Theelectronic apparatus 1 outputs moving picture data generated byexecuting a game program or video/audio data acquired from a recordingmedium such as an optical disk and/or video/audio data acquired througha network to a display apparatus such as a television set. Theelectronic apparatus 1 is not limited to an entertainment apparatus suchas a game apparatus and may be a personal computer.

As depicted in FIG. 2, the electronic apparatus 1 includes a main body10. The upper side of the main body 10 is covered with an upper cover 50that configures an exterior member A of the electronic apparatus 1. Thelower side of the main body 10 is covered with the lower cover 60 thatconfigures the exterior member A. As depicted in FIG. 3, the main body10 is configured from the frame 20 and various parts attached to theframe 20. As hereinafter described, in the example of the electronicapparatus 1, also the frame 20 configures the exterior member A.

As depicted in FIG. 3, for example, the cooling fan 5, an optical diskdrive 7, a power supply unit 40 and so forth are attached to the frame20. In the example of the electronic apparatus 1, the cooling fan 5 andthe optical disk drive 7 are disposed at a front portion of theelectronic apparatus 1 and are juxtaposed in a leftward and rightwarddirection. The power supply unit 40 is disposed behind the cooling fan 5and the optical disk drive 7. The power supply unit 40 has a case 42. Acircuit board 41 (refer to FIG. 5) on which a power supply circuit ismounted is accommodated in the case 42. The layout of the parts providedin the electronic apparatus 1, namely, the layout of the cooling fan 5,the optical disk drive 7, and the power supply unit 40, is not limitedto the example of the electronic apparatus 1. Further, the electronicapparatus 1 may not necessarily include all of the components describedabove. For example, the electronic apparatus 1 may not include theoptical disk drive 7.

As depicted in FIG. 3, the frame 20 has a frame outer periphery 21. Theframe outer periphery 21 surrounds a plurality of parts provided in theelectronic apparatus 1. In the example of the electronic apparatus 1,the frame outer periphery 21 surrounds the optical disk drive 7, thecooling fan 5, and the power supply unit 40 described above (refer toFIG. 4A). The frame outer periphery 21 has a substantially square shapeas viewed in top plan and has a front wall portion 21A, a right wallportion 21B, a rear wall portion 21C, and a left wall portion 21D. Thefront wall portion 21A is a wall portion positioned in front of theparts described above. An insertion opening 21 n for insertion of anoptical disk into the optical disk drive 7 may be formed at the frontwall portion 21A. The rear wall portion 21C is a wall portion positionedat the opposite side to the front wall portion 21A. The right wallportion 21B is positioned in the rightward direction with respect to theparts described above, and the left wall portion 21D is a wall portionpositioned at the opposite side to the right wall portion 21B. The innerside of the frame outer periphery 21 is open in the vertical direction.In particular, the frame outer periphery 21 has a cylindrical shape.

As depicted in FIG. 3, the main body 10 includes a circuit board 31, anupper chassis 32, and a lower chassis 33. The chassis 32 and 33 areconfigured from a plate of metal such as aluminum or iron and covers theupper face and the lower face of the circuit board 31, respectively.Electronic parts such as an integrated circuit that controls theelectronic apparatus 1 or executes an image process and so forth aremounted on the circuit board 31. The chassis 32 and 33 prevent radiationof an electromagnetic wave outputted from the parts such as anintegrated circuit and prevent an electromagnetic wave from an externalapparatus from having an influence on the electronic parts on thecircuit board 31. In an example, the chassis 32 and 33 entirely coverthe circuit board 31. However, the chassis 32 and 33 may cover only aregion of the circuit board 31 in which the parts such as an integratedcircuit 31 a are mounted.

The circuit board 31 and the chassis 32 and 33 are disposed at the lowerside of the parts described hereinabove disposed at the inner side ofthe frame outer periphery 21. In the example of the electronic apparatus1, the circuit board 31 and the chassis 32 and 33 are positioned at thelower side of the cooling fan 5 and the power supply unit 40 (refer toFIG. 5). The circuit board 31 and the chassis 32 and 33 are attached tothe frame 20. More particularly, the circuit board 31 and the chassis 32and 33 are attached to the frame outer periphery 21. In the example ofthe electronic apparatus 1, the circuit board 31 and the chassis 32 and33 are attached to the front wall portion 21A, the right wall portion21B, and the rear wall portion 21C of the frame outer periphery 21. Afixture such as, for example, a machine screw is utilized for attachmentof the circuit board 31 and the chassis 32 and 33. The electronicapparatus 1 may not necessarily include the two chassis 32 and 33. Inother words, a chassis may be provided only on one face of the circuitboard 31.

As depicted in FIG. 3, the electronic apparatus 1 has a heatsink 34. Theheatsink 34 is in direct or indirect contact with a heat generating partsuch as the integrated circuit 31 a (refer to FIG. 5) mounted on thecircuit board 31. The heatsink 34 is disposed in an air flow path S2(refer to FIG. 4A) hereinafter described which extends from the coolingfan 5. In the example of the electronic apparatus 1, the heatsink 34 isattached to the upper chassis 32. In particular, as depicted in FIG. 5,the heatsink 34 has a base portion 34 a and a plurality of fins 34 bfixed to the upper side of the base portion 34 a. The upper chassis 32has formed therein a hole of a size corresponding to the heatsink 34,and the fins 34 b of the heatsink 34 are fitted in the hole of the upperchassis 32 from the lower side. The heatsink 34 is fixed at the baseportion 34 a thereof to an edge of the hole of the upper chassis 32. Thefins 34 b are positioned at the upper side of the upper chassis 32 andpositioned in the air flow path S2. The attachment structure of theheatsink 34 is not limited to the example of the electronic apparatus 1but may be modified suitably.

As depicted in FIG. 3, the electronic apparatus 1 includes the metalplate 39. The metal plate 39 is disposed at the opposite side to thechassis 32 and 33 and the circuit board 31 across the cooling fan 5. Inthe example of the electronic apparatus 1, the metal plate 39 isdisposed at the upper side of the cooling fan 5. Further, the metalplate 39 is attached to the frame 20. More particularly, the metal plate39 is attached to the frame outer periphery 21. The frame 20 is formedfrom an acrylonitrile butadiene styrene (ABS) resin, a resin ofpolystyrene or the like. Meanwhile, the metal plate 39 is formed from ametal such as aluminum or iron. With such a structure that utilizes themetal plate 39 as just described, the rigidity of the frame 20 can beenhanced without increasing the thickness of the wall portions 21A, 21B,21C, and 21D of the frame 20.

Preferably, the metal plate 39 is attached to at least three ones fromamong the four wall portions 21A, 21B, 21C, and 21D that configure theframe outer periphery 21. The structure just described can moreeffectively enhance the rigidity of the frame outer periphery 21. Asdepicted in FIG. 6, in the example of the electronic apparatus 1, themetal plate 39 is attached to the right wall portion 21B, the front wallportion 21A, and the left wall portion 21D of the frame outer periphery21. In an example, the metal plate 39 is attached to an upper edge ofthe frame outer periphery 21. As another example, an attachment portionmay be formed at the inner side of the frame outer periphery 21 suchthat the metal plate 39 is attached to the attachment portion. For theattachment of the metal plate 39, a fixture such as, for example, amachine screw is utilized.

The attachment structure of the metal plate 39 is not limited to theexample described here. For example, the metal plate 39 may be attachedonly two ones from among the four wall portions 21A, 21B, 21C, and 21Dof the frame outer periphery 21. As hereinafter described, the metalplate 39 functions as a wall that covers the cooling fan 5 and definesan air flow path. Accordingly, the metal plate 39 may be attached toonly two wall portions positioned proximate to the cooling fan 5 (in theexample of the electronic apparatus 1, to the front wall portion 21A andthe right wall portion 21B). As a further example, the metal plate 39may be attached to all of the four wall portions 21A, 21B, 21C, and 21D.In this case, the metal plate 39 may cover all parts disposed at theinner side of the frame outer periphery 21 or may cover only part of theparts disposed at the inner side of the frame outer periphery 21.

As described hereinabove, the electronic apparatus 1 has the cooling fan5 and the heatsink 34 disposed on the inner side of the frame outerperiphery 21. Further, the electronic apparatus 1 has vents E1 and E2(refer to FIG. 9). Here, the term “vent” signifies a boundary betweenthe outside and the inside of the exterior member A of the electronicapparatus 1. In particular, external air exists at the outside of thevents E1 and E2, and air in the exterior member A becomes external airat an instant at which it passes the vents E1 and E2. The electronicapparatus 1 has, as the vents E1 and E2, exhaust ports for exhaustingair in the exterior member A to the outside. In the example of theelectronic apparatus 1, the exhaust ports E1 and E2 are provided in therear wall portion 21C of the frame outer periphery 21. At the inner sideof the frame outer periphery 21, air flow paths S1, S2, and S3 areformed which extend from the cooling fan 5 to the exhaust ports E1 andE2 (refer to FIG. 4A).

In the example of the electronic apparatus 1, the cooling fan 5 isdisposed such that a rotational center line C1 thereof (refer to FIG. 6)extends in the vertical direction. As depicted in FIG. 4A, the air flowpaths include a first flow path S1 formed on the outer periphery of thecooling fan 5 and curved arcuately, and the second flow path S2 formedon the rear side of the cooling fan 5 and connecting to the first flowpath S1. The heatsink 34 is disposed in the second flow path S2. The sirflow paths further include a third flow path S3 formed on the rear sideof the heatsink 34 and connecting to the second flow path S2. Asdescribed hereinabove, the electronic apparatus 1 has the power supplyunit 40 at a rear portion thereof. The power supply unit 40 has thecircuit board 41, and the case 42 that accommodates the circuit board 41therein. The third flow path S3 is configured by the case 42, and thecircuit board 41 is disposed in the third flow path S3 (refer to FIG.5). The exhaust ports E1 and E2 are provided on the rear side of thecase 42. A power supply circuit is mounted on the circuit board 41. Thepower supply circuit supplies driving power to various parts provided inthe electronic apparatus 1.

When the cooling fan 5 is driven, air flows out from the cooling fan 5to the first flow path S1. Thereafter, the air flows into the secondflow path S2 and passes the heatsink 34. Then, the air flows into thethird flow path S3. In particular, the air flows into the case 42 of thepower supply unit 40. Thereafter, the air is discharged to the outsidefrom the exhaust ports E1 and E2.

The metal plate 39 and the frame 20 have portions that function as wallsthat define the air flow path. In particular, the metal plate 39 and theframe 20 have portions that function as walls for partitioning an innerside and an outer side of the air flow paths. In the example of theelectronic apparatus 1, the metal plate 39 and the frame 20 haveportions that function as walls for defining the first flow path S1 andthe second flow path S2. In this manner, the metal plate 39 has afunction for increasing the rigidity of the frame 20 and a function as awall for defining the flow paths S1 and S2. Consequently, the necessityfor a member for exclusive use for defining the upper wall of the flowpaths S1 and S2 is eliminated. As a result, the number of parts can bereduced. Further, the height of the electronic apparatus can be reducedby an amount corresponding to the member for exclusive use.

As depicted in FIGS. 4B and 6, the frame 20 has a flow path wall 22 thatdefines the first flow path S1 and the second flow path S2. The flowpath wall 22 is a wall that defines an outer profile of the flow pathsS1 and S2 as viewed in plan. The flow path wall 22 surrounds the coolingfan 5 and the heatsink 34 as viewed in plan.

In the example of the electronic apparatus 1, the flow path wall 22 hasa curved wall portion 22A that surrounds the outer periphery of thecooling fan 5 and is curved along the outer periphery of the cooling fan5. The first flow path S1 is formed between the cooling fan 5 and thecurved wall portion 22A. The curved wall portion 22A is connected at oneend portion thereof (in the example of the electronic apparatus 1, aright end portion) to the right wall portion 21B of the frame outerperiphery 21. Accordingly, a front portion of the right wall portion 21Bfunctions as part 22B of the flow path wall 22 (the part 22B ishereinafter referred to as first side wall portion 22B). The flow pathwall 22 has a second side wall portion 22C that extends rearwardly fromthe other end portion of the curved wall portion 22A (in the example ofthe electronic apparatus 1, a left end portion). The second flow path S2is formed between the first side wall portion 22B and the second sidewall portion 22C. The inner side of the flow path wall 22 is open in thevertical direction.

As depicted in FIG. 6, the metal plate 39 has a portion 39A thatfunctions as an upper side wall of the first flow path S1 and the secondflow path S2 (the portion 39A is hereinafter referred to as flow pathupper wall portion 39A). In particular, the flow path upper wall portion39A closes up the upper side of the flow paths S1 and S2. The flow pathupper wall portion 39A has a first wall portion 39Aa that functions asan upper side wall of the first flow path S1, and a second wall portion39Ab that functions as an upper side wall of the second flow path S2.The second wall portion 39Ab covers the heatsink 34.

As depicted in FIG. 6, the cooling fan 5 has, at a bottom portionthereof, an attachment plate 5 c attached to the lower side of the frameouter periphery 21. The attachment plate 5 c closes up the lower side ofthe first flow path S1 and functions as a lower side wall of the firstflow path S1. Further, as described hereinabove, the upper chassis 32 isattached to the lower side of the frame outer periphery 21. The upperchassis 32 has a portion that functions as a lower side wall of thesecond flow path S2. Accordingly, the flow paths S1 and S2 arepartitioned from a space therearound by the frame 20, the metal plate39, the upper chassis 32, and the attachment plate 5 c.

The flow path upper wall portion 39A of the metal plate 39 is connectedto the flow path wall 22 of the frame 20. In particular, the flow pathupper wall portion 39A is connected to the entire upper edge of the flowpath wall 22 (namely, to an upper edge of the curved wall portion 22Aand the side wall portions 22B and 22C). By the configuration justdescribed, air in the flow paths S1 and S2 is suppressed from leaking tothe outer side of the flow paths S1 and S2. In the example of theelectronic apparatus 1, the frame 20 has a plurality of attachmentportions 22 a disposed along the flow path wall 22 and the frame outerperiphery 21 as depicted in FIG. 6. The metal plate 39 is placed on theflow path wall 22 of the frame 20 and attached to the attachment portion22 a by a fixture such as a machine screw. Consequently, the flow pathupper wall portion 39A of the metal plate 39 contacts closely with anupper edge of the flow path wall 22 of the frame 20

FIG. 7 is an enlarged view of a region denoted by reference characterVII in FIG. 5. As depicted in FIG. 7, the metal plate 39 has an edgepositioned on the flow path wall 22 of the frame 20. A protrusion 22 bis formed at an upper edge of the flow path wall 22 of the frame 20along an edge of the metal plate 39 and positioned on the outer side ofthe edge of the metal plate 39. The protrusion 22 b surrounds the edgeof the metal plate 39. In the example of the electronic apparatus 1, afront edge 39 d (refer to FIG. 6) of the first wall portion 39Aa themetal plate 39 has and a right edge 39 e (refer to FIG. 6) of the secondwall portion 39Ab are positioned on the flow path wall 22 of the frame20 (more particularly, on the curved wall portion 22A and the first sidewall portion 22B). The protrusion 22 b is formed on an upper edge of thecurved wall portion 22A and the first side wall portion 22B. Theprotrusion 22 b is formed along edges 39 d and 39 e of the metal plate39 and positioned on the outer sides of the edges 39 d and 39 e of themetal plate 39. Leakage of air from between the edges 39 d and 39 e ofthe metal plate 39 and the upper edge of the flow path wall 22 can besuppressed more effectively by the protrusion 22 b.

As depicted in FIG. 6, the cooling fan 5 has a rotor 5 a and a pluralityof fins 5 b that rotate integrally with the rotor 5 a. The fins 5 bextend in radial directions from the rotor 5 a. A fin cover portion 39 cis provided on the first wall portion 39Aa of the metal plate 39 andcovers the upper side of a base portion of the fins 5 b. In the exampleof the electronic apparatus 1, the fin cover portion 39 c is formedannularly. The rotor 5 a is positioned at the inner side of the fincover portion 39 c as viewed in plan view. In other words, the metalplate 39 does not exist above the rotor 5 a. By the structure justdescribed, the height of the electronic apparatus 1 can be reduced by anamount equal to the thickness of the metal plate 39. The shape of themetal plate 39 is not limited to this. For example, the fin coverportion 39 c may not be provided on the metal plate 39, and the metalplate 39 may have a portion that covers the upper side of the rotor 5 a.

As depicted in FIG. 6, a step is formed between the fin cover portion 39c and the first wall portion 39Aa. More particularly, the position ofthe first wall portion 39Aa is lower than the position of the fin coverportion 39 c. Openings 39 h are formed between an inner peripheral edgeof the first wall portion 39Aa and an outer peripheral edge of the fincover portion 39 c. When the cooling fan 5 is driven, external air flowsto the cooling fan 5 through the openings 39 h. With the structuredescribed above in which the position of the first wall portion 39Aa andthe position of the fin cover portion 39 c are displaced from each otherin the vertical direction, it becomes easy to assure a size of theopenings 39 h. As a result, the air intake efficiency can be enhanced.The fin cover portion 39 c is connected at an outer peripheral edgethereof to an inner peripheral edge of the first wall portion 39Aathrough a plurality of connecting portions 39 f.

As depicted in FIG. 1, the electronic apparatus 1 has, in the exteriormember A thereof, an inlet P1 for taking in external air therethrough.In the example of the electronic apparatus 1, the inlet P1 is providedin a right side face and a left side face of the electronic apparatus 1.More particularly, a right wall portion 51B of the upper cover 50 and aright wall portion 61B of the lower cover 60 are positioned in a spacedrelationship from each other in the vertical direction, and the inlet P1is formed between the right wall portion 51B and the right wall portion61B. An air flow path is formed between the right wall portion 21B ofthe frame outer periphery 21 and the right wall portion 51B of the uppercover 50, and air introduced in from the inlet P1 passes between theright wall portion 21B of the frame outer periphery 21 and the rightwall portion 51B of the upper cover 50 and flows toward the upper sideof the cooling fan 5. Similarly, another air flow path is formed betweenthe right wall portion 21B of the frame outer periphery 21 and the rightwall portion 61B of the lower cover 60, and air introduced in from theinlet P1 passes between the right wall portion 21B of the frame outerperiphery 21 and the right wall portion 61B of the lower cover 60 andflows toward the lower side of cooling fan 5. The air coming to thelower side of the cooling fan 5 is introduced to the cooling fan 5through an opening 5 d formed in the attachment plate 5 c. Also on theleft side of the electronic apparatus 1, an inlet is provided similarlyas on the right side of the electronic apparatus 1. The left wallportion of the upper cover 50 and the left wall portion of the lowercover 60 are positioned in a spaced relationship from each other in thevertical direction, and an inlet is formed between them. The position ofthe inlet is not limited to that of the example of the electronicapparatus 1 but may be changed suitably.

The metal plate 39 may have a portion that covers a part different fromparts disposed along the air flow path such as the cooling fan 5 and theheatsink 34. In the example of the electronic apparatus 1, the opticaldisk drive 7 is disposed at the front portion of the electronicapparatus 1. As depicted in FIG. 6, the metal plate 39 has a portion 39Bthat covers the optical disk drive 7 (the portion 39B is hereinafterreferred to as part cover portion 39B). In the example of the electronicapparatus 1, the optical disk drive 7 has, on the upper side of an upperface thereof, part of a mechanism for transporting an optical disk. Themechanism is covered with the part cover portion 39B. Where the opticaldisk drive 7 is covered with the metal plate 39 in this manner, thenecessity for a cover for exclusive use for covering the optical diskdrive 7 is eliminated. As a result, the number of parts can be reduced.Further, the height of the electronic apparatus can be reduced by anamount equal to the height of the cover for exclusive used.

The part covered by the part cover portion 39B is not limited to theoptical disk drive 7. Alternatively, the metal plate 39 may not have thepart cover portion 39B thereon. In other words, the entire metal plate39 may function as the flow path upper wall portion 39A.

As described hereinabove, the air flow paths include the third flow pathS3 following the second flow path S2. The wall that defines the thirdflow path S3 is configured from the case 42 of the power supply unit 40.The flow path upper wall portion 39A of the metal plate 39 and the flowpath wall 22 of the frame 20 are connected to a vent 42 d formed in thecase 42. In the example of the electronic apparatus 1, the vent 42 d isformed in a front face of the case 42 (refer to FIG. 3). As depicted inFIG. 5, a rear edge 39 g of the flow path upper wall portion 39A of themetal plate 39 is connected to an upper edge of the vent 42 d. The sidewall portions 22B and 22C of the frame 20 are connected to left andright edges of the vent 42 d. This can suppress leakage of air to theouter side between the second flow path S2 and the third flow path S3.

As described hereinabove, the electronic apparatus 1 has, as theexterior member A thereof, the upper cover 50 that covers the upper sideof the main body 10 and the lower cover 60 that covers the lower side ofthe main body 10. Further, in the example of the electronic apparatus 1,part of the frame 20 is exposed to the outside from between the uppercover 50 and the lower cover 60. More particularly, the upper cover 50has a peripheral wall 51 that surrounds the outer periphery of the frameouter periphery 21 as viewed in plan of the electronic apparatus 1. Thelower cover 60 has a peripheral wall 61 that surrounds the outerperiphery of the frame outer periphery 21 as viewed in plan of theelectronic apparatus 1. A lower edge of the peripheral wall 51 of theupper cover 50 and an upper edge of the peripheral wall 61 of the lowercover 60 are spaced from each other in the vertical direction, and theframe outer periphery 21 is exposed to the outside from between thelower edge of the peripheral wall 51 of the upper cover 50 and the upperedge of the peripheral wall 61 of the lower cover 60. Accordingly, inthe electronic apparatus 1, the exterior member A is configured from thecovers 50 and 60 and the frame 20.

The exterior member A has the exhaust ports E1 and E2 for dischargingair having passed through the air flow paths S1, S2, and S3 describedhereinabove to the outside. FIGS. 8 to 10 depict a structure of theexhaust ports E1 and E2. FIG. 8 is a rear elevational view of theelectronic apparatus 1. FIG. 9 is a sectional view taken along lineIX-IX of FIG. 8. FIG. 10 is a perspective view depicting the rear sideof the frame 20, the power supply unit 40, and the lower cover 60.

In the example of the electronic apparatus 1, the case 42 of the powersupply unit 40 has an opening 42 f provided at the rear side thereof(refer to FIG. 10). As depicted in FIG. 9, the exterior member A has theexhaust ports E1 and E2 at a rear portion of the case 42. Air in thecase 42 (air in the third flow path S3) is discharged to the outsidethrough the exhaust ports E1 and E2.

As depicted in FIG. 9, the exterior member A has a plurality ofshielding portions provided at positions thereof behind the power supplyunit 40. In the example of the electronic apparatus 1, the exteriormember A includes three shielding portions H1, H2, and H3 providedthereon (in the following description, where the three shieldingportions are to be identified from each other, they are referred to asfirst shielding portion H1, second shielding portion H2, and thirdshielding portion H3). The shielding portions H1, H2, and H3 areportions in the form of an elongated plate extending in the leftward andrightward direction. In the example of the electronic apparatus 1, theshielding portions H1, H2, and H3 have a length substantiallycorresponding to the width of the electronic apparatus 1 in the leftwardand rightward direction.

In the example of the electronic apparatus 1, the first shieldingportion H1 is provided on the rear wall portion 21C of the frame 20 asdepicted in FIG. 9. The second shielding portion H2 is configured from arear wall portion 51C that configures the peripheral wall 51 of theupper cover 50 and a panel portion 21 m provided on the rear wallportion 21C of the frame 20. The rear wall portion 51C of the uppercover 50 is positioned behind the panel portion 21 m of the frame 20 andconfigures the second shielding portion H2. The second shielding portionH2 may not necessarily be configured from two members. For example, thesecond shielding portion H2 may be configured only from the rear wallportion 51C of the upper cover 50.

The third shielding portion H3 configures a rear wall of an air flowpath S5 hereinafter described. In the example of the electronicapparatus 1, the peripheral wall 61 of the lower cover 60 has a rearwall portion 61C as depicted in FIGS. 9 and 10. An upper side portion ofthe rear wall portion 61C configures a rear wall of the air flow path S5and serves as the third shielding portion H3.

The shielding portions H1, H2, and H3 are not limited to the examplesdescribed here. Each of the shielding portions H1, H2, and H3 may beprovided on any of the frame 20 and the covers 50 and 60. The number ofshielding portions to be provided on the electronic apparatus 1 is notlimited to three. The number of shielding portions may be two or four ormore.

The shielding portions H1, H2, and H3 are juxtaposed in the verticaldirection as viewed in the forward and rearward direction. In otherwords, the shielding portions H1, H2, and H3 are juxtaposed in thevertical direction as viewed in rear elevation of the electronicapparatus 1 as depicted in FIG. 8. In the example of the electronicapparatus 1, the second shielding portion H2 is positioned higher thanthe first shielding portion H1. The third shielding portion H3 ispositioned on the opposite side to the position of the second shieldingportion H2 across the position of the first shielding portion H1 in thevertical direction. In the example of the electronic apparatus 1, thethird shielding portion H3 is positioned lower than the first shieldingportion H1. The first shielding portion H1 and the second shieldingportion H2 neighbor with each other in the vertical direction as viewedin the forward and rearward direction. In other words, if the firstshielding portion H1 and the second shielding portion H2 are viewed inthe forward and rearward direction, then any other shielding portiondoes not exist between the first shielding portion H1 and the secondshielding portion H2. Similarly, if the first shielding portion H1 andthe third shielding portion H3 are viewed in the forward and rearwarddirection, then they neighbor with each other in the vertical direction.In other words, when the first shielding portion H1 and the thirdshielding portion H3 are viewed in the forward and rearward direction,any other shielding portion does not exist between them.

If the first shielding portion H1 and the second shielding portion H2are viewed in the forward and rearward direction, then they arepreferably disposed such that part of the second shielding portion H2overlaps with part of the first shielding portion H1. Where the firstshielding portion H1 and the second shielding portion H2 are disposed inthis manner, a part disposed on the inner side of the exterior member A(in the example of the electronic apparatus 1, the circuit board 41 ofthe power supply unit 40 or a part 41 b mounted on the circuit board 41)can be prevented from being exposed to the outside from between the twoshielding portions H1 and H2. In the example of the electronic apparatus1, a lower edge of the second shielding portion H2 overlaps with anupper edge of the first shielding portion H1 as viewed in rear elevationof the electronic apparatus 1. In other words, the lower edge of thesecond shielding portion H2 and the upper edge of the first shieldingportion H1 are positioned at the same height. The two shielding portionsH1 and H2 may overlap with each other over a greater range. The firstshielding portion H1 is positioned such that it overlaps with a part 41b mounted on the circuit board 41 as viewed in rear elevation of theelectronic apparatus 1.

In the example of the electronic apparatus 1, the third shieldingportion H3 is positioned lower than the lower edge of the firstshielding portion H1. In other words, as viewed in rear elevation of theelectronic apparatus 1, a very small gap is formed between the upperedge of the third shielding portion H3 and the lower edge of the firstshielding portion H1. The air discharging efficiency can be enhanced bythe gap. As hereinafter described in detail, the circuit board 41 isdisposed in a displaced relationship from a center C2 of the firstshielding portion H1 in the vertical direction to the second shieldingportion H2 side. Therefore, the circuit board 41 or a part on thecircuit board 41 can be suppressed from being exposed through the gapbetween the upper edge of the third shielding portion H3 and the loweredge of the first shielding portion H1. In place of the example of theelectronic apparatus 1, the first shielding portion H1 and the thirdshielding portion H3 may be disposed such that, when they are viewed inthe forward and rearward direction, part of the third shielding portionH3 overlaps with part of the first shielding portion H1. For example,the first shielding portion H1 and the third shielding portion H3 may bedisposed such that the upper edge of the third shielding portion H3overlaps with the lower edge of the first shielding portion H1 as viewedin rear elevation of the electronic apparatus 1. The two shieldingportions H1 and H3 may overlap with each other over a greater range. Inthis case, also the first shielding portion H1 and the second shieldingportion H2 may be disposed such that part of the second shieldingportion H2 overlaps with part of the first shielding portion H1 asviewed in rear elevation of the electronic apparatus 1.

As a further example, the upper edge of the third shielding portion H3may be positioned lower than the lower edge of the first shieldingportion H1 and besides the lower edge of the second shielding portion H2described hereinabove may be positioned a little higher than the upperedge of the first shielding portion H1 (in other words, the twoshielding portions H1 and H2 may have a gap therebetween and also thetwo shielding portions H1 and H3 may have a gap therebetween). In thiscase, preferably the gap between the upper edge of the third shieldingportion H3 and the lower edge of the first shielding portion H1 and thegap between the lower edge of the second shielding portion H2 and theupper edge of the first shielding portion H1 are sized such that a userhardly visually recognize the circuit board 41 or the like through thegaps. As a still further example, conversely to the example of theelectronic apparatus 1, the lower edge of the second shielding portionH2 may be positioned a little higher than the upper edge of the firstshielding portion H1 and besides the upper edge of the third shieldingportion H3 may be positioned at the same height with or lower than thelower edge of the first shielding portion H1 (in other words, while agap is provided between the two shielding portions H2 and H1, no gap maybe provided between the two shielding portions H1 and H3). In this case,the circuit board 41 may be disposed in a displaced relationship fromthe center C2 of the first shielding portion H1 in the verticaldirection to the third shielding portion H3 side.

As depicted in FIG. 9, the first shielding portion H1 and the secondshielding portion H2 are disposed in a displaced relationship from eachother in the forward and rearward direction. The first exhaust port E1described hereinabove is formed between the first shielding portion H1and the second shielding portion H2. With the structure just described,the air discharging efficiency can be enhanced without leading toexposure of the circuit board 41 of the power supply unit 40 or the likeby making the distance between the two shielding portions H1 and H2greater in the forward and rearward direction. In the example of theelectronic apparatus 1, the second shielding portion H2 is positionedbehind the first shielding portion H1.

Preferably, the second shielding portion H2 and the first shieldingportion H1 do not overlap with each other as viewed in plan. In otherwords, preferably the second shielding portion H2 is entirely positionedbehind a rear end (upper end) of the first shielding portion H1. Thismakes it easy to assure a high air discharging efficiency.

As depicted in FIG. 9, also the first shielding portion H1 and the thirdshielding portion H3 are disposed in a displaced relationship from eachother in the forward and rearward direction. The second exhaust port E2is formed between the first shielding portion H1 and the third shieldingportion H3. With the structure just described, the air dischargingefficiency can be enhanced without leading to exposure of the circuitboard 41 of the power supply unit 40 or the like by making the distancebetween the two shielding portions H1 and H3 greater. In the example ofthe electronic apparatus 1, the third shielding portion H3 is positionedbehind the first shielding portion H1.

Preferably, also the third shielding portion H3 and the first shieldingportion H1 do not overlap with each other as viewed in plan. In otherwords, preferably the third shielding portion H3 is entirely positionedbehind the rear end (upper end) of the first shielding portion H1.

As depicted in FIG. 9, the second shielding portion H2 and the thirdshielding portion H3 are displaced in the same direction from the firstshielding portion H1. By the structure just described, the width of theentire shielding portions H1, H2, and H3 in the forward and rearwarddirection can be reduced in comparison with an alternative structurethat, for example, the second shielding portion H2 and the thirdshielding portion H3 are displaced from each other in the oppositedirections to each other from the first shielding portion H1. As aresult, the electronic apparatus 1 can be down-sized.

In the example of the electronic apparatus 1, both of the secondshielding portion H2 and the third shielding portion H3 are positionedbehind the first shielding portion H1. As a result, the second exhaustport E2 and the first exhaust port E1 are provided such that they opposeto each other in the vertical direction. The second exhaust port E2positioned at the upper side is open downwardly while the first exhaustport E1 positioned at the lower side is open upwardly. By the structurejust described, the exhaust ports E1 and E2 can be prevented from beingexposed to the outside. The layout of the shielding portions H1, H2, andH3 is not limited to the example described here. For example, the thirdshielding portion H3 may be positioned in front of the first shieldingportion H1, and the second shielding portion H2 may be positioned behindthe first shielding portion H1.

As depicted in FIG. 9, an air flow path S4 is formed at the upper sideof the first shielding portion H1. Air having passed the air flow pathS4 is discharged from the first exhaust port E1. As depicted in FIG. 10,a plurality of guide portions H4 are provided in the air flow path S4such that they extend from the position of the first shielding portionH1 toward the second shielding portion H2. The guide portions H4 arejuxtaposed in the leftward and rightward direction. A flow of air isguided in the forward and rearward direction by the guide portions h4.In the example of the electronic apparatus 1, the guide portions H4 areformed integrally with the frame 20. The guide portions H4 connect theupper edge of the first shielding portion H1 and the second shieldingportion H2 to each other.

As described hereinabove, the air flow path S5 (refer to FIG. 9) isformed at the lower side of the first shielding portion H1. Air havingpassed the air flow path S5 is discharged from the second exhaust portE2. As depicted in FIG. 10, a plurality of guide portions H5 areprovided in the air flow path S5 such that they extend from the positionof the first shielding portion H1 toward the third shielding portion H3.The guide portions H5 are juxtaposed in the leftward and rightwarddirection. A flow of air is guided in the forward and rearward directionby the guide portions H5. In the example of the electronic apparatus 1,the guide portions H5 are formed integrally with the frame 20. Moreparticularly, the guide portions H5 are formed on a bottom panel portion21 g that defines the bottom of the air flow path S5.

As described hereinabove, the power supply unit 40 is disposed in frontof the shielding portions H1, H2, and H3. The circuit board 41 isdisposed at the inner side of the case 42 of the power supply unit 40.As depicted in FIG. 9, the circuit board 41 is disposed in a displacedrelationship from the center C2 of the first shielding portion H1 in thevertical direction to the second shielding portion H2 side. In theexample of the electronic apparatus 1, the circuit board 41 is displacedupwardly from the center C2 of the first shielding portion H1. Thedistance between the second shielding portion H2 and the circuit board41 in the forward and rearward direction is greater than the distancebetween the first shielding portion H1 and the circuit board 41 in theforward and rearward direction. With such a layout of the circuit board41 and the second shielding portion H2 as just described, the circuitboard 41 can be suppressed from making an obstacle to a flow of air.

As depicted in FIG. 9, a rear edge 41 a of the circuit board 41 ispositioned in front of the first shielding portion H1. An air flow pathis formed between the rear edge 41 a of the circuit board 41 and thefirst shielding portion H1. With the layout just described, air flowingat the lower side of the circuit board 41 can be discharged from thefirst exhaust port E1 past the flow path between the rear edge 41 a ofthe circuit board 41 and the first shielding portion H1. As a result,the cooling performance for a part mounted on the circuit board 41 canbe enhanced.

In the example of the electronic apparatus 1, the circuit board 41 ispositioned higher than the upper edge of the first shielding portion H1.Consequently, the distance between the rear edge 41 a of the circuitboard 41 and the first shielding portion H1 can be assured readily, anda flow of air passing the air flow path formed between them can befurther smoothened.

As depicted in FIG. 9, the first shielding portion H1 is inclined suchthat the distance between the circuit board 41 and the first shieldingportion H1 increases toward the second shielding portion H2. In otherwords, the first shielding portion H1 is inclined such that an upperportion thereof is positioned behind a lower portion thereof. With thestructure of the first shielding portion H1, the distance between therear edge 41 a of the circuit board 41 and the first shielding portionH1 is more likely to be assured, and a flow of air can be furthersmoothened. In the example of the electronic apparatus 1, the secondshielding portion H2 and the third shielding portion H3 are inclined tothe rear side similarly to the first shielding portion H1. The shieldingportions H1, H2, and H3 may not necessarily be inclined. In other words,the shielding portions H1, H2, and H3 may be disposed vertically.

As depicted in FIG. 9, a protrusion 42 b is formed on an upper wallportion 42 a of the case 42 so as to project downwardly. The circuitboard 41 is positioned at a lower end of the protrusion 42 b and isspaced downwardly from the upper wall portion 42 a. Consequently, thecircuit board 41 or the part 41 b mounted on the circuit board 41 can beprevented from being visually recognized from the outside through thefirst exhaust port E1. In the example of the electronic apparatus 1, theprotrusion 42 b has a form of a wall extending in the forward andrearward direction.

As described hereinabove, the circuit board 41 is disposed in anupwardly displaced relationship from the center C2 of the firstshielding portion H1 in the vertical direction. Various parts (partssuch as, for example, a transformer that configures a power supplycircuit) are mounted on a lower face of the circuit board 41. The airflow path S5 is formed on the lower side of the first shielding portionH1, and the second exhaust port E2 for discharging air in the air flowpath S5 is formed between the first shielding portion H1 and the thirdshielding portion H3. With the layout of the circuit board 41 and thesecond exhaust port E2, air passing the part 41 b of the circuit board41 (air passing a lower portion of the case 42) can be dischargedsmoothly from the second exhaust port E2. As a result, the coolingperformance for parts mounted on the circuit board 41 can be enhanced.

As depicted in FIG. 9, the second shielding portion H2 is spaced by agreat distance from the case 42 in comparison with the first shieldingportion H1. The case 42 has a wall portion that defines the air flowpath S4 which extends to the first exhaust port E1. In the example ofthe electronic apparatus 1, the case 42 has the upper wall portion 42 aand a lower wall portion 42 c. The upper wall portion 42 a extendsrearwardly by a greater distance than the lower wall portion 42 c. Theupper wall portion 42 a is connected at a rear edge 42 g thereof to thesecond shielding portion H2. More particularly, the rear edge 42 g ofthe upper wall portion 42 a is connected to the upper end of the secondshielding portion H2. The air flow path S4 is defined by the upper wallportion 42 a. The structure of the case 42 is not limited to the exampledescribed here. For example, in place of the upper wall portion 42 a ofthe case 42, a panel portion configuring an upper wall of the air flowpath S4 formed at the upper side of the first shielding portion H1 maybe provided on the rear wall portion 21C of the frame 20.

The bottom of the air flow path S5 formed on the lower side of the firstshielding portion H1 is defined by the bottom panel portion 21 g. Thebottom panel portion 21 g is provided on the rear wall portion 21C ofthe frame 20. The case 42 is connected at a rear edge 42 h of the lowerwall portion 42 c thereof to a front edge of the bottom panel portion 21g.

Various parts may be disposed also below the power supply unit 40. Forexample, in the example of the electronic apparatus 1, a hard diskapparatus 8 is disposed below the power supply unit 40 as depicted inFIG. 9. The hard disk apparatus 8 is covered at the lower side thereofwith the lower cover 60.

Further, a part such as a connector mounted on the circuit board 31 maybe disposed below the power supply unit 40. In this case, as depicted inFIG. 10, the rear wall portion 21C of the frame 20 and the rear wallportion 61C of the lower cover 60 may have openings 21 h and 61 h formedtherein for exposing connectors to the rear therethrough.

As described hereinabove, the electronic apparatus 1 has the metal plate39. The metal plate 39 is disposed on the opposite side to the chassis32 and 33 and the circuit board 31 across the cooling fan 5 and attachedto the frame 20. With such a structure as just described by which themetal plate 39 is utilized, the rigidity of the frame 20 can be improvedwithout increasing the thickness of the wall portions 21A, 21B, 21C, and21D of the frame 20.

Further, the exterior member A of the electronic apparatus 1 has thefirst shielding portion H1 and the second shielding portion H2 disposedin a displaced relationship from each other in the forward and rearwarddirection. The first exhaust port E1 described hereinabove is formedbetween the first shielding portion H1 and the second shielding portionH2. With the structure just described, by making the distance betweenthe two shielding portions H1 and H2 greater in the forward and rearwarddirection, the air discharging efficiency can be enhanced withoutleading to exposure of the circuit board 41 of the power supply unit 40or the like.

It is to be noted that the exterior member A herein signifies a memberthat configures at least part of an outer face of the electronicapparatus. Accordingly, the exterior member A is not limited to any ofthe covers 50 and 60 and the frame 20. For example, a different membermay be attached to the cover 50 or 60 (here, the member attached to thecover 50 or 60 is referred to as attached member). If the attachedmember is exposed partly or entirely to the outer face of the electronicapparatus, then also the attached member configures the exterior memberA. In this case, all or part of the shielding portions H1, H2, and H3may be provided on the attached member.

Further, in the example of the electronic apparatus 1, the shieldingportions H1, H2, and H3 are formed integrally on the exterior member A.In particular, the first shielding portion H1 is formed integrally withthe frame 20. Meanwhile, the rear wall portion 51C configuring thesecond shielding portion H2 is formed integrally with the upper cover50, and the panel portion 21 m configuring the second shielding portionH2 is formed integrally with the frame 20. Further, the third shieldingportion H3 is formed integrally with the lower cover 60. However, eachof the shielding portions H1, H2, and H3 may be a member formedseparately from the exterior member A. Further, the shielding portionsH1, H2, and H3 may be attached to the exterior member A using a fixturesuch as a machine screw or using an engaging pawl formed on theshielding portions H1, H2, and H3.

The present technology is not limited to the embodiment described aboveand can be carried out in various altered forms.

For example, in the electronic apparatus 1, the exhaust ports E1 and E2may not be formed by the shielding portions H1, H2, and H3 displacedfrom each other in the forward and rearward direction.

Further, the electronic apparatus 1 may not necessarily have such a partas the optical disk drive 7 or the power supply unit 40.

The present technology contains subject matter related to that disclosedin Japanese Priority Patent Application JP 2016-073336 filed in theJapan Patent Office on Mar. 31, 2016, the entire content of which ishereby incorporated by reference.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An electronic apparatus comprising: a pluralityof parts; a frame having an outer periphery surrounding the plurality ofparts and formed from resin, where an air flow path is formed at aninner side of the outer periphery of the frame; a circuit board disposedat one side in a first direction with respect to the plurality of parts;a chassis disposed at the one side in the first direction with respectto at least one of the plurality of parts, attached to the frame, andformed from metal; and a metal plate disposed at an other side in thefirst direction with respect to the at least one of the plurality ofparts and attached to the frame, wherein: the metal plate and the frameeach have a respective portion that functions as a wall defining the airflow path, the respective portion of the frame is a flow path wallportion that defines an outer shape of the air flow path when the airflow path is viewed in the first direction, and the respective portionof the metal plate is connected to the flow path wall portion of theframe.
 2. The electronic apparatus according to claim 1, wherein theouter periphery of the frame has a first wall portion positioned in asecond direction orthogonal to the first direction with respect to theplurality of parts, a second wall portion positioned at the oppositeside to the first wall portion across the plurality of parts, a thirdwall portion positioned in a third direction orthogonal to the firstdirection with respect to the plurality of parts, and a fourth wallportion positioned at the opposite side to the third wall portion acrossthe plurality of parts, and the metal plate is attached to at leastthree wall portions from among the first, second, third, and fourth wallportions.
 3. The electronic apparatus according to claim 1, wherein themetal plate and the chassis are attached to the outer periphery of theframe.
 4. The electronic apparatus according to claim 1, wherein theportion of the metal plate functions as a wall of the air flow path atthe other side in the first direction.
 5. The electronic apparatusaccording to claim 1, wherein the metal plate has an edge disposed onthe flow path wall portion of the frame, and a protrusion is formedalong the edge of the metal plate at the flow path wall portion of theframe and positioned at the outer side of the edge of the metal plate.6. The electronic apparatus according to claim 5, wherein the pluralityof parts include a cooling fan, the cooling fan is disposed such that arotational center line thereof is directed to the first direction, andthe flow path wall portion of the frame surrounds the outer periphery ofthe cooling fan.
 7. The electronic apparatus according to claim 6,wherein a heatsink is disposed in the air flow path, and the metal platecovers the cooling fan and the heatsink.
 8. An electronic apparatus,comprising: a plurality of parts including a fan and a heat sink; aframe having an outer periphery surrounding the fan and formed fromresin, where an air flow path is formed at an inner side of the outerperiphery of the frame; a circuit board disposed at one side in a firstdirection with respect to the plurality of parts; a chassis disposed atthe one side in the first direction with respect to the fan, attached tothe frame, and formed from metal; and a metal plate disposed at an otherside in the first direction with respect to the fan and attached to theframe, wherein: the metal plate and the frame each have a respectiveportion that functions as a wall defining the air flow path, therespective portion of the frame is a flow path wall portion that definesan outer shape of the air flow path when the air flow path is viewed inthe first direction, and the respective portion of the metal plate isconnected to the flow path wall portion of the frame.
 9. The electronicapparatus according to claim 8, wherein the metal plate and the chassisare attached to the outer periphery of the frame.
 10. The electronicapparatus according to claim 8, wherein the portion of the metal platefunctions as a wall of the air flow path at the other side in the firstdirection.
 11. The electronic apparatus according to claim 8, whereinthe metal plate has an edge disposed on the flow path wall portion ofthe frame, and a protrusion is formed along the edge of the metal plateat the flow path wall portion of the frame and positioned at the outerside of the edge of the metal plate.
 12. An electronic apparatuscomprising: a plurality of parts; a frame having an outer peripherysurrounding the plurality of parts and formed from resin, where an airflow path is formed at an inner side of the outer periphery of theframe; a circuit board disposed at one side in a first direction withrespect to the plurality of parts; a chassis disposed at the one side inthe first direction with respect to the plurality of parts and formedfrom metal; and a metal plate disposed at another side in the firstdirection with respect to at least one of the plurality of parts andattached to the frame, wherein: the metal plate and the frame each havea respective portion that functions as a wall defining the air flowpath, the respective portion of the frame is a flow path wall portionthat defines an outer shape of the air flow path when the air flow pathis viewed in the first direction, and the respective portion of themetal plate is connected to the flow path wall portion of the frame. 13.The electronic apparatus according to claim 12, wherein the outerperiphery of the frame has a first wall portion positioned in a seconddirection orthogonal to the first direction with respect to theplurality of parts, a second wall portion positioned at the oppositeside to the first wall portion across the plurality of parts, a thirdwall portion positioned in a third direction orthogonal to the firstdirection with respect to the plurality of parts, and a fourth wallportion positioned at the opposite side to the third wall portion acrossthe plurality of parts, and the metal plate is attached to at leastthree wall portions from among the first, second, third, and fourth wallportions.
 14. The electronic apparatus according to claim 12, whereinthe metal plate and the chassis are attached to the outer periphery ofthe frame.
 15. The electronic apparatus according to claim 12, whereinthe portion of the metal plate functions as a wall of the air flow pathat the other side in the first direction.
 16. The electronic apparatusaccording to claim 12, wherein the metal plate has an edge disposed onthe flow path wall portion of the frame, and a protrusion is formedalong the edge of the metal plate at the flow path wall portion of theframe and positioned at the outer side of the edge of the metal plate.17. The electronic apparatus according to claim 16, wherein theplurality of parts include a cooling fan, the cooling fan is disposedsuch that a rotational center line thereof is directed to the firstdirection, and the flow path wall portion of the frame surrounds theouter periphery of the cooling fan.
 18. The electronic apparatusaccording to claim 17, wherein a heatsink is disposed in the air flowpath, and the metal plate covers the cooling fan and the heatsink.